SOLDER WIRE
Qualitek utilizes state-of-the-art wire extrusion and wire drawing machines to manufacture low residue/fine diameter wire solders. Many of our formulations use the latest in no-clean/low residue technology found in our solder pastes and solder fluxes. We also developed our flux core manufacturing process to eliminate flux voids and irregular wire. Formulations available for: No-Clean, Water-Soluble, Rosin Mildly Activated, Super Activated Resin and Rosin Activated. Solid wire is also available. Qualitek wire solders meet or exceed J-STD-004B.
NO CLEAN
FLUX CORE
FEATURES
J-STD-004B
RoHS Compliant
NC611
No-Clean flux has excellent activity, clear residue and low flux spatter
REL0
Yes
NC600
No-Clean flux contains a very effective activator and spread like an RA flux. Available with several lead-free and leaded alloys.
REL0
Yes/ No
NC601
No-Clean core flux has excellent spread properties leaving virtually no post-soldering residue. Available with several lead-free and leaded alloys.
ORL0
Yes/ No
WATER SOLUBLE
FLUX CORE
FEATURES
J-STD-004B
RoHS Compliant
WS700
Formulated for electronic applications where fast wetting and ease of cleaning with water is required. Available with several lead-free and leaded alloys.
ORH1
Yes/ No
ROSIN BASED
FLUX CORE
FEATURES
J-STD-004B
RoHS Compliant
RMA200
Rosin Mildly Activated flux formulated for high reliability electronic assembly. Available with several lead-free and leaded alloys.
ROL0
Yes/ No
RA300
Rapid wetting, fast-flowing flux core that contains non-conductive post-soldering residues. Available with several lead-free and leaded alloys.
ROM1
Yes/ No
SRA500
Super Rosin Activated flux core is recommended for highly oxidized or difficult to solder to metals. Available with lead-free alloys.
ROH1
Yes/ No