SOLDER PASTE
NO CLEAN
TYPE
FEATURES
J-STD-004B
RoHS COMPLIANT
DSP825HF
Superior resistance to hot slump
Extended stencil life and tack
Meduim soft non-cracking residue/pin testable.
Anti-voids
Suitable with air or nitrogen atmosphere
ROL0
Yes
DSP618D
Low residues
Low tack time
Excellent wettability
Hard non-conductive residues
ROL0
Yes
DSP618DP
Very low voids
Low tack time
Excellent wettability
ROL0
Yes
DSP838T
Superior resistance to hot slump
Extended stencil life and tack
Low voiding
Suitable with air or nitrogen atmosphere
Halogen free
ROL0
Yes
670I
Robust Drop-in ready Sn/Pb paste with low residue and non-conductive residues
REL0
No
XP692
Excellent wettability, extended tack time, yields soft, non-tacky residues
REL0
No
863
Low voiding paste with excellent wettability
ROL0
Yes
866
Zero-halogen paste with light-colored, pin probable residues
ROL0
Yes
875
Superior low flux spatter
REL0
Yes
615D
Dispensing solder paste with hard non-conductive residues
REL0
No
618D
Specifically designed for Pb-Free applications, easily dispensed for rework applications
ROL0
Yes
619D
Dispensing solder paste with transparent, pin testable post soldering residues
REL0
No
WATER SOLUBLE
TYPE
FEATURES
J-STD-004B
RoHS COMPLIANT
DSP780ZH
Very low voids
Long tack time
Excellent wettability
Extended stencil life
Low foaming during DI Cleaning
ORH0
DSP718D
Low foaming
Yields bright, shiny joints
Easily dispensed
Excellent wettability
ORH0
DSP718DP
Yields bright, shiny joints
Easily dispensed
Excellent wettability
ORH0
DSP760LED
Very low voids
Long tack time
Excellent wettability
Extended stencil life
Low foaming during DI cleaning
ROH0
769LF
Newest solder paste formulation, features Zero-Halogen.
Enhanced print characteristics on fine pitch pads.
Excellent wetting/coalescence and cleanability
ORH0
Yes
787LV
Lowest voiding solder paste formulated for fine pitch printing with enhanced stencil life
ORH0
Yes
788
Non-hygroscopic paste where residues are easily removed, long stencil life
ORL0
No
792
Robust Sn/Pb paste designed for ultrafine pitch printing, Halide-free, 792 also exhibits excellent performance with Pb-free alloys
ORM0
Yes/ No
798
Excellent wetting on OSP surfaces, pin testable paste with low residues
ORM0
No
798LF
Water soluble paste withe enhanced activity for a broad range of application, exhibits excellent printing characteristics with easy residue removal properties
ORH0
Yes
XP799
Designed for superior wetting on OSP surfaces with extended stencil life
ORL0
No
717D
Halide-free dispensing paste with easy removal of residues
ORL0
No
718D
Dispensing solder paste designed specifically for Pb-free applications
ORH0
Yes
ROSIN BASED
TYPE
J-STD-004B
J-STD-004B
RoHS COMPLIANT
230
RMA solder paste that meets no-clean requirements, Excellent soldering performance for both Sn/Pb and lead-free applications
ROL0
Yes/No
215D
Dispensing RMA solder paste with hard, non conductive residues
ROL0
Yes/No
350
Robust Sn/Pb formulation for Sn/Pb and lead free applications
ROM1
Yes/No
HALOGEN FREE
TYPE
FEATURES
J-STD-004B
RoHS COMPLIANT
699
Halogen-Free paste with excellent wetting and coalescence for fine pitch
ROL0
No
825HF
Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence
ROL0
Yes
863
Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence
ROL0
Yes