SEMICONDUCTOR MATERIALS
Qualitek offers a range of technologically advanced materials engineered to fulfill the demanding applications for the semiconductor industry. Qualitek’s offerings include Wafer Bumping Fluxes, Wafer Bumping Paste Fluxes, Flip Chip Fluxes and Ball Attached Paste Fluxes.
TYPE
FEATURES
FLUX TYPE
APPLICATION METHOD
FLUX CLASSIFICATION
HALOGEN CONTENT
WF-710
Wafer Bumping Flux:
Uniform bump shape, non-corrosive to underbump metallization.
Water-Soluble
Spin Coating
ORL0
Halogen-Free
WF-710
Wafer Bumping Flux:
Avoids wetting on copper pillar.
Water-Soluble
Spin Coating
ORH0
Halogen-Free
PF-709WB
Wafer Bumping Paste Flux:
Consisten printability, excellent attachment of solder spheres onto wafer.
Water-Soluble
Printing
ROL0
Halogen-Free
Delta X1
Flip Chip Flux:
Extremely low residue, compatible with underfills.
No-Clean
Dipping
ROL0
Zero-Halogen
PF-709AD
Ball Attached Paste Flux:
Stable transfer volume, excellent attachment of solder spheres onto BGA/CSP.
Water-Soluble
Pin Transfer/ Dipping
ORH0
Halogen-Free