SELECTIVE SOLDER SOLID CORE & FLUX
Qualitek offers a range of technologically advanced materials engineered to fulfill the demanding applications for the semiconductor industry. Qualitek’s offerings include Wafer Bumping Fluxes, Wafer Bumping Paste Fluxes, Flip Chip Fluxes and Ball Attached Paste Fluxes.
If your selective soldering equipment has a vision recognition option,
it will differentiate leaded and lead-free wire based on spool color.
Selective Solder Solid Core Alloys: 8 lb. spool ea.:
Lead Free Green Spool – Alloys: SAC 305 (Sn96.5/Ag3.5/Cu0.5) Common Ag Alloy, Delta 99C® (Sn99.3/Cu0.7/Ni<0.1/Ge<0.01) Drop In Alloy, Sn100e® (Sn99.5/Cu0.5/Co trace alloy) LF Ag, Bi Free Alloy
Leaded White Spool – Alloys: Sn63/Pb37 Common Leaded Alloy, Sn60/Pb40 Common Leaded Alloy
TYPE
FEATURES
S.G.@25°C
% SOLIDS / ACID NO.
J-STD-004B
THINNER
302
Halogen-Free flux with very low solids, may be used for LEADED and LEAD-FREE applications for a broader process window.
0.800
2.3 / 20.0
ORL0
300A
393
Halogen-Free, low solids flux, may be usede for LEADED & LEAD-FREE alloys.
Good Solderability, non-tacky low residues for improved cosmetics.
0.811
2.9 / 23.5
ORL0
300A
380
Rosin-based flux leads to higher activity.
Recommended for LEADED wave applications.
0.793
3.3 / 18.2
ROL0
300A
381
Low solids flux compatible with both LEADED and LEAD-FREE systems that eliminates skips and shorts often experienced with wave assembly.
0.800
3.7 / 20.5
ROL0
300A
399-42
Halogen-Free, low solids flux, compatible with both LEADED & LEAD-FREE systems.
Excellent wettability, non-conductive and tack-free residues.
0.832
4.5 / 36.0
ORL0
300A
305
Rosin-based, Halogen-Free flux designed for single and double sided plated through hole boards.
Recommended for LEADED.
0.795
5.0 / 25.0
ROL0
300A
386
Rosin-containing flux provides excellent solderability for both general and high density boards.
Use for LEADED and LEAD-FREE applications.
0.800
2.3 / 20.0
ORL0
300A